Equipped with a fully automated wafer handling system, achieving efficient macro/micro inspection. The BAWL-06 features and excellent optical imaging system, enabling high-definition capture of micro details on wafers. With a versatile macro inspection module and a flexible and easy-to-use remote-control joystick, it enables multi-angle, full-field macro inspection, making it an efficient tool for wafer defect analysis.

1.EFEM system

The EFEM system is equipped with automatic loading and unloading modules and is compatible with various wafer sizes. It is an essential component of wafer inspection equipment. In a highly clean environment, individual wafers are transferred to the inspection module through a precision mechanical arm. The core components include the loadport, wafer transport robot, and wafer aligner.

Open Cassette

2.Mapping

Using a high-precision optical detection system, wafers are scanned layer by layer to record wafer position information. It can quickly and accurately identify tilted or misaligned wafers and provide alarms for abnormal states, achieving 100% accuracy.

Cassette Mapping: Standard

Oblique Insertion

3.High-precision wafer pre-alignment

A non—contact optical method is used to locate the center and notch/flat of the wafer.

The fully automated intelligent pre-alignment mechanism achieves accurate and fast positioning of the inspection target. It’s more efficient in operation and more precise in data collection.

Suitable for various wager materials such as Si, SIC, EMC, Glass, etc.

4.Macro Inspection

The BAWL series includes a macro inspection are that can perform a 360° rotation for macro inspection of wafer surfaces and backs, making it easy to detect defects and particles on the front, black, and edge sides of the wafer. The wafer can be tilted for observation using the control lever. By rotating and tilting the wager at multiple angles, the entire front, back, and edge of the wafer can be visually inspected. Various light sources, including yellow and green, are available to accommodate different working conditions.

Surface macro inspection

Edge inspection

Backside inspection

5.Precision optical micro inspection

Using a wide-beam imaging system, it supports a world-leading ultra-wide field of view of 25mm, providing a new experience of large-field vision.

The optical system is equipped with a polarizing system with polarizing and differential interference contrast imaging systems for high contrast, high-resolution micro-imaging.

5X Bright Field

10X Bright Field

20X Bright Field

50X Bright Field

100X Bright Field

5X Dark Field

10X Dark Field

20X Dark Field

50X Dark Field

100X Dark Field

6.Precision optical electric components

The equipment’s objective and aperture diaphragm are controlled by an automatic electric control system. The control buttons are in front of the equipment platform, making them easily accessible.

The user-friendly electric design not only avoids frequent manual operations but also make your inspection work more precise and flexible. Controls within reach, helping you improve efficiency.

7.Professional APO objective with infinite long working distance

The long working distance BD plan semi-apochromatic metallurgical objectives satisfy observation methods such as bright field, dark field, polarization and DIC. The brightness enhancement of the image in the dark field improves the detection ability of the sample. This series of objective strictly selects high transmittance lenses and advanced coating technology to truly restore the natural color of the sample. The bright and dark field objective is made of special process materials, which greatly reduces weight and contributes to preventing environmental pollution and improving the controllability of objective conversion. The semi-apochromatic design has excellent color correction performance, improving the contrast and clarity of observed images. Long working distance objective lenses are widely used in various testing fields, easily achieving non-destructive testing.

8.Advanced image analysis software

The image processing software, equipped with hardware accessories such as electric platform, electric Z-axis, electric converter, and light source control, supports automatic large image stitching, depth fusion, automatic focusing, 3D measurement, and is compatible with 64-bit Windows systems.

Functions including: auto focus, light source control, electronic control function, measurement module, image library management, depth fusion, particle counting, image stitching, 3D view, 3D measurement.

9.Data communication system

The wafer inspection system supports the SECS/GEM semiconductor standard communication protocol, acting as a communication bridge between the equipment and customer MES and other host systems, enabling functions such as work order issuance, material accounting, process recording, and remote control.

The system is equipped with a user-friendly human-machine interface system, making it easy to operate and monitor wafer workstations in real time.

It can recognize various wafer cassette types and is equipped with a high-precision wafer OCR reader. With the unique ID of each wafer, it monitors the entire process data of the wafer. It allows data extraction, modification, and change of the inspection work more efficient and reliable.

The system is compatible with power outage protection devices, allowing the equipment to maintain IPC system operation for 15 minutes in case of power outage, providing enough time for data saving.

10.Reliability

The BAWL series wafer inspection system has high stability and transmission rate. The system uses a safety design compliant with SEMI standards, with built-in UPS uninterruptible power supply, a vacuum holding system, an efficient and stable dual-arm mechanical arm, and various safety interlock functions. It safely and reliably places wafer or warped wafers at various equipment workstation sites.

Note: ● Standard Outfit, ○ Optional